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Angle view BGA Voids Bond Die Crack
Pattern Crack PBGA #1 PBGA #2 PBGA
SBGA Shrinkage Solder Ball Void Solder Bridge
Tilt view Voids #1 Voids #2 Voids
     
Voids      


Drill-Offset FOD Hole to Hole Measure IC Solder Joint
Pattern Pattern Open #1 Pattern Open #2 Pattern Open
Pin hole align Pin hole Open Short Short
SMD Solder Joint #1 Solder Joint #2 Voids
   
Voids #2 Voids #3    


Contour Relief #1 Contour Relief #2 Excess Solder Insuff
Max Magnification Pseudo Color #1 Pseudo Color #2 SBGA Tilt view
Solder Ball lifted Solder Bridge #1 Solder Bridge #2 Solder Bridge #3
Solder Bridge #4 Solder Joint #1 Solder Joint #2 Solder Splash
   
Solder Voids Wire Sweep Measure    


Bond wire Burns Capacitor #1 Capacitor
Cell Chip Layer Crack #1 Crack #2
IC Socket Internal Voids Missing Wire Open & Crack
Open Open Wire #1 Open Wire #2 Voids
 
Wire Bent Wire Short Wire Sweep  


Burn Disk Arm short #1 Disk Arm Short #2 Ejector Pumps
Ejector Pumps #1 Motor Cap Short #1 Short
Short #3 Short #4 Voids #5 Voids
Voids #7 Voids #8 Voids #9


BGA BGA Voids Die attached Voids #1 Die attached Voids #2
Die attached Voids #3 Excess IC Open Ball
QFP RFIC Side view SOIC #1
SOIC #2 Solder Ball Void Solder Joint Voids
 
Wire Short Wire Sweeping Wire Sweeping  



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