이미지를 누르시면 더 큰 이미지를 보실 수 있습니다... Angle view BGA Voids Bond Die Crack Pattern Crack PBGA #1 PBGA #2 PBGA SBGA Shrinkage Solder Ball Void Solder Bridge Tilt view Voids #1 Voids #2 Voids 　 　 　 Voids 　 　 　 Drill-Offset FOD Hole to Hole Measure IC Solder Joint Pattern Pattern Open #1 Pattern Open #2 Pattern Open Pin hole align Pin hole Open Short Short SMD Solder Joint #1 Solder Joint #2 Voids 　 　 Voids #2 Voids #3 　 　 Contour Relief #1 Contour Relief #2 Excess Solder Insuff Max Magnification Pseudo Color #1 Pseudo Color #2 SBGA Tilt view Solder Ball lifted Solder Bridge #1 Solder Bridge #2 Solder Bridge #3 Solder Bridge #4 Solder Joint #1 Solder Joint #2 Solder Splash 　 　 Solder Voids Wire Sweep Measure 　 　 Bond wire Burns Capacitor #1 Capacitor Cell Chip Layer Crack #1 Crack #2 IC Socket Internal Voids Missing Wire Open & Crack Open Open Wire #1 Open Wire #2 Voids 　 Wire Bent Wire Short Wire Sweep 　 Burn Disk Arm short #1 Disk Arm Short #2 Ejector Pumps Ejector Pumps #1 Motor Cap Short #1 Short Short #3 Short #4 Voids #5 Voids Voids #7 Voids #8 Voids #9 BGA BGA Voids Die attached Voids #1 Die attached Voids #2 Die attached Voids #3 Excess IC Open Ball QFP RFIC Side view SOIC #1 SOIC #2 Solder Ball Void Solder Joint Voids 　 Wire Short Wire Sweeping Wire Sweeping

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